NVIDIA at OCP Global Summit: Vera Rubin Open Specifications and 400Gb/s Optical Interconnects with Cisco
At the OCP Global Summit, NVIDIA contributed open rack specifications for its Vera Rubin architecture and partnered with Cisco on ultra-dense 400Gb/s USFP optical interconnects.
tveniu Editorial Staff
Analysis & Research Desk
At the Open Compute Project (OCP) Global Summit, NVIDIA contributed the mechanical, electrical, and thermal architectures of its next-generation Vera Rubin computing platform to open industry governance. The milestone accelerates standardization across global hyperscale facilities.
Co-Packaged Optics Breakthrough with Cisco
In collaboration with Cisco, NVIDIA demonstrated ultra-dense 400Gb/s Ultra Small Form Factor Pluggable (USFP) optical transceivers, delivering a 25% energy efficiency dividend compared to legacy pluggable architectures at rack scale.
- Full Vera Rubin rack reference designs contributed directly to the Open Compute Project
- Joint Cisco-NVIDIA 400Gb/s USFP optical module specification enabling extreme harness density
- 800V DC power delivery integration matched with dual-manifold liquid cold-plate distribution
- Full protocol interoperability with open Ethernet switching and telemetry stacks
De-Risking Megawatt-Scale Facilities
By publishing open mechanical standards, independent datacenter builders gain the blueprints required to fabricate AI factories using multi-sourced contract manufacturers while avoiding proprietary lock-in.
βAt multi-megawatt rack density, proprietary physical envelopes are obsolete. Open specifications are the prerequisite for global scale.β
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